Infineon has launched the CoolSiC MOSFET 1200 V G2 in a top-side-cooled (TSC) Q-DPAK package. The new devices deliver optimised thermal performance, system efficiency, and power density. They were ...

Ambiq Micro touts ultra-low power chips for AI at the edge, but recent revenue growth has stalled, and losses remain large.

TSMC’s exit from GaN fabrication is paving the way for IDM model to take over with a tight design-manufacturing coupling.

The plan builds on Malaysia’s status as the world’s sixth-largest semiconductor exporter, which saw electrical and ...

Skywater signs agreement with Infineon, giving it access to a library of silicon-proven, mixed-signal ASIC design IP.

With the IP, SkyWater users can design and build mixed-signal system-on-chips (SoCs) in a secure U.S. supply chain. The IP will be released through SkyWater’s S130 platform for both commercial and ...

Detailed price information for Infineon Technologies Ag (IFNNF) from The Globe and Mail including charting and trades.

Utilising Infineon's improved .XT die attach interconnection technology, the G2 devices achieve more than 15 percent lower thermal resistance and an 11 percent reduction in MOSFET temperature compared ...

SkyWater, the US foundry, has  licensed a  library of silicon-proven, mixed-signal ASIC design IP from Infineon. The IP ...

SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, today announced a license agreement with ...

The CoolSiC MOSFETs 1200 V G2 are available in two Q-DPAK configurations: a single switch and a dual half-bridge. Both variants are part of Infineon’s broader X-DPAK top-side cooling platform and are ...

By Ozan Ergenay (Reuters) -German semiconductor materials supplier Siltronic on Tuesday lowered its full-year sales guidance and warned on sales in the next quarter, amidst continued weakness in its ...