PIC100 technology in 300 mm high-volume production for leading hyperscalers, with plans to quadruple capacity by 2027 and further expand in 2028 Geneva, Switzerland — March 9 th, 2026 — ...
Abstract: In this Letter, we employed atomic layer deposition (ALD) and flash lamp annealing (FLA) to form a wafer-scale ultra-shallow junction (USJ, ~5 nm) in silicon. The deep ultraviolet light is ...
Abstract: This article presents a novel noncontact sensor architecture for indoor radon gas detection based on a silicon photodiode sensor optimized for alpha particle detection. Unlike traditional ...
Nobody likes power cords, and batteries always need recharging or replacing. What if your device could run on only the power ...
New research describes multimodal sensor fusion for AI-based fault detection in 3D printing.
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