Abstract: Cu-Cu direct bonding is an important technology in advanced semiconductor chip packaging for 3D integration. It offers benefits such as reduced vertical dimensions and increased ...
Abstract: The success of wafer-to-wafer or chip-to-chip bonding in 3-D packaging relies on the development of planarized, activated, and oxygen-free Cu surface. Preventing Cu oxidation is becoming a ...
Master floristul Nicu Bocancea, hair-stylist-ul Adrian Perjovschi împreună cu echipa sa de beauty, wedding planner-ul Ivona Nenu și fashion designerul Andreea Veneciuc dau startul trendurilor în ...
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