(PR) What’s New: At the IEEE International Electron Devices Meeting (IEDM) 2024, Intel Foundry unveiled new breakthroughs to help drive the semiconductor industry forward into the next decade and ...

Advanced packaging has become a focal point for innovation as the semiconductor industry continues to push for increased transistor density and better performance. But the pace of change is ...

2.5D and 3D Packaging Technology: The 2.5D and 3D packaging technologies encompass various packaging techniques. In 2.5D packaging, the choice of interposer material categorizes it into Si-based, ...

SK hynix Inc. announced Wednesday (April 3) that it plans to invest close to $4 billion to build an advanced packaging fabrication and R&D facility for AI products in the Purdue Research Park. The ...

A surge in demand for chips is impacting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, key components, and equipment. Spot shortages in ...