TO-220 segment held the dominant share of 51.25% in 2025E due to its cost efficiency and robust thermal performance. TO-247 is the fastest-growing package type, growing at a CAGR of 9.26%, driven by ...
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Intel looks beyond silicon, outlines breakthroughs in atomically-thin 2D transistors, chip packaging, and interconnects at IEDM 2024
Today, the Intel Foundry Technology Research team announced technology breakthroughs in 2D transistor technology using beyond ...
Austin, Nov. 26, 2025 (GLOBE NEWSWIRE) -- Transistor Outline (TO) Package Market Size & Growth Insights: According to the SNS Insider,“The Transistor Outline (TO) Package Market size was valued at USD ...
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